Invention Publication
- Patent Title: ISOLATION OF SEMICONDUCTOR DEVICES BY BURIED SEPARATION RAILS
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Application No.: US17554061Application Date: 2021-12-17
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Publication No.: US20230197527A1Publication Date: 2023-06-22
- Inventor: Richard Geiger , Peter Baumgartner , Alexander Bechtold , Uwe Hodel , Richard Hudeczek , Walther Lutz , Carla Moran Guizan , Georgios Panagopoulos , Johannes Xaver Rauh , Roshini Sachithanandan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L23/528 ; H01L23/535 ; H01L23/522 ; H01L27/092
Abstract:
IC devices including semiconductor devices isolated by BSRs are disclosed. An example IC device includes a first and a second semiconductor devices, a support structure, and a BSR. The BSR defines boundaries of a first and second section in the support structure. At least a portion of the first semiconductor device is in the first section, and at least a portion of the second semiconductor device is in the second section. The first semiconductor device is isolated from the second semiconductor device by the BSR. Signals from the first semiconductor device would not be transmitted to the second semiconductor device through the support structure. The BSR may be connected to a TSV or be biased. The IC device may include additional BSRs to isolate the first and second semiconductor devices. An BSR may be a power rail used for delivering power.
Information query
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