- 专利标题: LIFT PIN ASSEMBLY AND SUBSTRATE TREATING APPARATUS
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申请号: US18145145申请日: 2022-12-22
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公开(公告)号: US20230215705A1公开(公告)日: 2023-07-06
- 发明人: Wan Hee JEONG , Kuk Saeng KIM , Jun Hyeak CHOI
- 申请人: SEMES CO., LTD.
- 申请人地址: KR Chungcheongnam-do
- 专利权人: SEMES CO., LTD.
- 当前专利权人: SEMES CO., LTD.
- 当前专利权人地址: KR Chungcheongnam-do
- 优先权: KR 20210193596 2021.12.31 KR 20220097529 2022.08.04
- 主分类号: H01J37/32
- IPC分类号: H01J37/32 ; H01L21/683 ; H01L21/687
摘要:
Disclosed is a lift pin assembly, including: a lift pin inserted into a pin hole; a moving plate moving up and down by a driving unit; a bellows module including a lower flange supported by the moving plate and a bellows shaft supporting the lift pins; and a pressurizing member provided between the lower flange and the moving plate to apply constant pressure in a lifting direction of the bellows module.
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