公开(公告)号：US20230124884A1

公开(公告)日：2023-04-20

申请号：US17747901

申请日：2022-05-18

Applicant: SEMES CO., LTD.

Inventor： Wan Hee JEONG ,  Kuk Saeng KIM ,  Jun Hyeak CHOI

IPC: H01L21/687

Abstract: A substrate lifting apparatus and a substrate processing apparatus for reducing deformation due to heat are provided. The substrate lifting apparatus comprises a plurality of pins in contact with a substrate, an upper plate for supporting the plurality of pins and having a plurality of upper connecting portions formed on a lower surface, a lower plate having a plurality of lower connecting portions connected to the plurality of upper connecting portions formed on an upper surface and disposed under the upper plate, and a driving unit for driving the plurality of pins to move up and down, wherein the lower plate supports a plurality of bushes and a plurality of shafts passing through the plurality of bushes on an upper surface thereof.

公开(公告)号：US20230311028A1

公开(公告)日：2023-10-05

申请号：US17702088

申请日：2022-03-23

Applicant: SEMES CO., LTD.

Inventor： Jung Suk GOH ,  Kuk Saeng KIM ,  Do-Youn LIM ,  Wan Hee JEONG

IPC: B01D21/28 ,  B01D21/00 ,  B01D35/06 ,  B01D21/34

CPC classification number: B01D21/283 ,  B01D21/0012 ,  B01D21/34 ,  B01D35/06

Abstract: The present invention provides a liquid supplying unit, including: a nozzle; a liquid supply pipe configured to supply a treatment liquid to the nozzle; and an impurity removing unit installed in the liquid supply pipe to remove an impurity in the treatment liquid, in which the impurity removing unit includes: a measuring unit configured to measure a characteristic of the impurity in the treatment liquid and form impurity data; a vibrating unit configured to apply vibration to the treatment liquid; a capturing unit configured to adsorb the impurity in the treatment liquid to which the vibration is applied; and a control unit configured to control the measuring unit and the vibration unit, and when the impurity data exceeds a reference data range, the control unit operates the vibrating unit.

公开(公告)号：US20230211966A1

公开(公告)日：2023-07-06

申请号：US18090513

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Wan Hee JEONG ,  Kuk Saeng KIM ,  Do Youn LIM ,  Noh Hoon MYOUNG

IPC: B65G54/02 ,  H01L21/677

CPC classification number: B65G54/02 ,  H01L21/67709 ,  H01L21/67724 ,  H01L21/67727 ,  H01L21/67733 ,  B65G2201/0297

Abstract: According to an embodiment of the present invention, there is provided an article transport vehicle capable of speeding up and reducing vibration in a manufacturing plant, a rail assembly, and an article transport system including the same. The article transport vehicle that conveys an article between manufacturing facilities along a rail of an article transport system in a manufacturing plant includes an article holder, a vehicle body, a magnetic levitation actuator, and a linear motor coil.

公开(公告)号：US20240014059A1

公开(公告)日：2024-01-11

申请号：US18124329

申请日：2023-03-21

Applicant: SEMES CO., LTD.

Inventor： Chan Young CHOI ,  Sang Oh KIM ,  Wan Hee JEONG ,  Hee Jae BYUN

IPC: H01L21/677 ,  H01L21/687 ,  B25J19/00 ,  B25J11/00 ,  B25J5/02 ,  H02J50/12

CPC classification number: H01L21/67733 ,  H01L21/68707 ,  B25J19/0045 ,  B25J11/0095 ,  B25J5/02 ,  H02J50/12

Abstract: Proposed is a power supply apparatus capable of suppressing heat generation, and semiconductor manufacturing equipment and a transport system including the same. The power supply apparatus, which supplies power to a transport device in semiconductor manufacturing equipment, includes a first base member made of a conductive material installed along a moving path of the transport device, a second base member provided on a surface of the first base member and made of a magnetic core material, a track member provided as an installation structure disposed on a side of the second base member, a power supply member installed in the track member and to which current is applied to supply power, and a power reception member disposed in a power reception core member provided in the transport device at a predetermined interval from the power supply member, and magnetically coupled to the power supply member to generate an induced current.

公开(公告)号：US20230338997A1

公开(公告)日：2023-10-26

申请号：US18105883

申请日：2023-02-06

Applicant: SEMES CO., LTD.

Inventor： Jae Hun JEONG ,  Cheol Yong SHIN ,  Wan Hee JEONG ,  Do Youn LIM

IPC: B08B11/02 ,  B08B3/02 ,  B08B3/08

CPC classification number: B08B11/02 ,  B08B3/02 ,  B08B3/08

Abstract: A support structure, includes: a support plate supporting a substrate; a lower cover covering a lower portion of the support plate; and a catching unit comprising a concave-convex structure having portions corresponding to each other so that the support plate and the lower cover are rotated and assembled with each other.

公开(公告)号：US20230207352A1

公开(公告)日：2023-06-29

申请号：US17750369

申请日：2022-05-22

Applicant: SEMES CO., LTD.

Inventor： Do Youn LIM ,  Kuk Saeng KIM ,  Wan Hee JEONG

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67132 ,  H01L21/6836 ,  H01L2221/68336

Abstract: Proposed is a wafer expander for uniformly expanding gaps between dies, and a die supplying module and die bonding equipment including the same. The wafer expander, for supporting a dicing tape to which a plurality of dies are attached and for expanding gaps between the plurality of dies, includes an expander ring detachably coupled to a wafer ring that fixes an edge of the dicing tape, and configured to ascend and descend, and a base ring supporting a bottom side of the dicing tape, and at least a portion thereof is configured to ascend and descend.

公开(公告)号：US20240112938A1

公开(公告)日：2024-04-04

申请号：US18134489

申请日：2023-04-13

Applicant: SEMES CO., LTD.

Inventor： Hee Jae BYUN ,  Kyo Bong KIM ,  Chan Young CHOI ,  Wan Hee JEONG ,  Sang Oh KIM

IPC: H01L21/68 ,  B25J11/00 ,  B25J13/08 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/681 ,  B25J11/0095 ,  B25J13/08 ,  H01L21/67259 ,  H01L21/68707

Abstract: A method and apparatus for aligning a wafer using a laser scanner, and a semiconductor transfer device are provided. The method includes a laser irradiation operation of irradiating a laser toward the wafer using a laser scanner disposed on a rear side or a lower side of the wafer and obtaining an image, a dataset acquisition operation of obtaining location information of at least three wafer edges by using a distance corresponding to a laser irradiation direction to a wafer edge in the image, a calculation operation of calculating a center point of the wafer by using the obtained location information of the wafer edge, and a detection operation of detecting whether a calculated center point is within a preset tolerance range.

公开(公告)号：US20230215705A1

公开(公告)日：2023-07-06

申请号：US18145145

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Wan Hee JEONG ,  Kuk Saeng KIM ,  Jun Hyeak CHOI

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32715 ,  H01L21/6833 ,  H01L21/68742 ,  H01J2237/20235 ,  H01J2237/2007 ,  H01J2237/334

Abstract: Disclosed is a lift pin assembly, including: a lift pin inserted into a pin hole; a moving plate moving up and down by a driving unit; a bellows module including a lower flange supported by the moving plate and a bellows shaft supporting the lift pins; and a pressurizing member provided between the lower flange and the moving plate to apply constant pressure in a lifting direction of the bellows module.

公开(公告)号：US20230207378A1

公开(公告)日：2023-06-29

申请号：US17735015

申请日：2022-05-02

Applicant: SEMES CO., LTD.

Inventor： Kuk Saeng KIM ,  Jun Hyeak CHOI ,  Wan Hee JEONG ,  Do Youn LIM

IPC: H01L21/687 ,  H01J37/32 ,  H01L41/09

CPC classification number: H01L21/68742 ,  H01J37/32724 ,  H01J37/3244 ,  H01L41/09 ,  H01J2237/334 ,  H01J2237/20235 ,  H01J2237/24578 ,  H01J37/321

Abstract: A substrate support unit includes a substrate support member that supports a substrate, the substrate support member being provided with one or more pin holes vertically penetrating the substrate support member, and a lift pin assembly provided to be lifted along a corresponding pin hole. The lift pin assembly includes lift pins, each lift pin having an upper end contacting the substrate and supporting the substrate, and a pin drive unit that is coupled to the lift pins and lifts the lift pins. The pin drive unit includes piezoelectric motors below the lift pins, respectively.

公开(公告)号：US20230159282A1

公开(公告)日：2023-05-25

申请号：US17990721

申请日：2022-11-20

Applicant: SEMES CO., LTD.

Inventor： Do-Youn LIM ,  Kuk Saeng KIM ,  Wan Hee JEONG

IPC: B65G47/90

CPC classification number: B65G47/90

Abstract: The inventive concept provides a transfer apparatus. The transfer apparatus includes a transfer truck; and a bumper device installed at any one of the front part or the rear part of the transfer truck, and wherein the bumper device includes: a bumper provided spaced apart from the transfer truck; and an impact attenuation unit provided between the bumper and the transfer truck and configured to attenuate an impact force transferred from the bumper to the transfer truck by a friction force.