公开(公告)号：US20230124884A1

公开(公告)日：2023-04-20

申请号：US17747901

申请日：2022-05-18

Applicant: SEMES CO., LTD.

Inventor： Wan Hee JEONG ,  Kuk Saeng KIM ,  Jun Hyeak CHOI

IPC: H01L21/687

Abstract: A substrate lifting apparatus and a substrate processing apparatus for reducing deformation due to heat are provided. The substrate lifting apparatus comprises a plurality of pins in contact with a substrate, an upper plate for supporting the plurality of pins and having a plurality of upper connecting portions formed on a lower surface, a lower plate having a plurality of lower connecting portions connected to the plurality of upper connecting portions formed on an upper surface and disposed under the upper plate, and a driving unit for driving the plurality of pins to move up and down, wherein the lower plate supports a plurality of bushes and a plurality of shafts passing through the plurality of bushes on an upper surface thereof.

公开(公告)号：US20230215705A1

公开(公告)日：2023-07-06

申请号：US18145145

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Wan Hee JEONG ,  Kuk Saeng KIM ,  Jun Hyeak CHOI

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32715 ,  H01L21/6833 ,  H01L21/68742 ,  H01J2237/20235 ,  H01J2237/2007 ,  H01J2237/334

Abstract: Disclosed is a lift pin assembly, including: a lift pin inserted into a pin hole; a moving plate moving up and down by a driving unit; a bellows module including a lower flange supported by the moving plate and a bellows shaft supporting the lift pins; and a pressurizing member provided between the lower flange and the moving plate to apply constant pressure in a lifting direction of the bellows module.

公开(公告)号：US20230207378A1

公开(公告)日：2023-06-29

申请号：US17735015

申请日：2022-05-02

Applicant: SEMES CO., LTD.

Inventor： Kuk Saeng KIM ,  Jun Hyeak CHOI ,  Wan Hee JEONG ,  Do Youn LIM

IPC: H01L21/687 ,  H01J37/32 ,  H01L41/09

CPC classification number: H01L21/68742 ,  H01J37/32724 ,  H01J37/3244 ,  H01L41/09 ,  H01J2237/334 ,  H01J2237/20235 ,  H01J2237/24578 ,  H01J37/321

Abstract: A substrate support unit includes a substrate support member that supports a substrate, the substrate support member being provided with one or more pin holes vertically penetrating the substrate support member, and a lift pin assembly provided to be lifted along a corresponding pin hole. The lift pin assembly includes lift pins, each lift pin having an upper end contacting the substrate and supporting the substrate, and a pin drive unit that is coupled to the lift pins and lifts the lift pins. The pin drive unit includes piezoelectric motors below the lift pins, respectively.