- 专利标题: HIGHLY ETCH SELECTIVE AMORPHOUS CARBON FILM
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申请号: US17963059申请日: 2022-10-10
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公开(公告)号: US20230029929A1公开(公告)日: 2023-02-02
- 发明人: Rajesh PRASAD , Sarah BOBEK , Prashant Kumar KULSHRESHTHA , Kwangduk Douglas LEE , Harry WHITESELL , Hidetaka OSHIO , Dong Hyung LEE , Deven Matthew Raj MITTAL , Scott FALK , Venkataramana R. CHAVVA
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L21/033
- IPC分类号: H01L21/033 ; C23C16/505 ; C23C16/26 ; C23C16/56 ; H01L21/311 ; H01L21/02 ; H01L21/3115
摘要:
Methods and techniques for deposition of amorphous carbon films on a substrate are provided. In one example, the method includes depositing an amorphous carbon film on an underlayer positioned on a susceptor in a first processing region. The method further includes implanting a dopant or the inert species into the amorphous carbon film in a second processing region. The implant species, energy, dose & temperature in some combination may be used to enhance the hardmask hardness. The method further includes patterning the doped amorphous carbon film. The method further includes etching the underlayer.
公开/授权文献
- US12112949B2 Highly etch selective amorphous carbon film 公开/授权日:2024-10-08
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