- 专利标题： Cured Epoxy Resin Composition Suitable for Electronic Device Enclosure, Articles, and Methods
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申请号： US18366753申请日： 2023-08-08
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公开(公告)号： US20230383114A1公开(公告)日： 2023-11-30
- 发明人: Brett A. Beiermann , John C. Clark , Eric G. Larson , Jeremy M. Higgins , Audrey S. Forticaux , Jay R. Lomeda , Wayne S. Mahoney , Scott B. Charles , Timothy D. Fletcher , Wendy L. Thompson , Kyle R. Schwartz
- 申请人： 3M INNOVATIVE PROPERTIES COMPANY
- 申请人地址： US MN St. Paul
- 专利权人： 3M INNOVATIVE PROPERTIES COMPANY
- 当前专利权人： 3M INNOVATIVE PROPERTIES COMPANY
- 当前专利权人地址： US MN St. Paul
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; C08K3/14 ; C08K3/22 ; C08K3/38 ; C08K7/20 ; H05K5/02
摘要：
An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
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