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1.发明申请公开(公告)号：US20200283619A1
公开(公告)日：2020-09-10
申请号：US16756518
申请日：2018-12-21
发明人： Brett A. Beiermann , John C. Clark , Eric G. Larson , Jeremy M. Higgins , Audrey S. Forticaux , Jay R. Lomeda , Wayne S. Mahoney , Scott B. Charles , Timothy D. Fletcher , Wendy L. Thompson , Kyle R. Schwartz
摘要： An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
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2.发明申请公开(公告)号：US20210363397A1
公开(公告)日：2021-11-25
申请号：US16763168
申请日：2018-11-15
发明人： Derek J. Dehn , Clinton P. Waller, Jr. , Bharat R. Acharya , Brandon A. Bartling , Audrey S. Forticaux , Jeremy M. Higgins , Satinder K. Nayar
摘要： Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm3; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.
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3.发明公开公开(公告)号：US20230383114A1
公开(公告)日：2023-11-30
申请号：US18366753
申请日：2023-08-08
发明人： Brett A. Beiermann , John C. Clark , Eric G. Larson , Jeremy M. Higgins , Audrey S. Forticaux , Jay R. Lomeda , Wayne S. Mahoney , Scott B. Charles , Timothy D. Fletcher , Wendy L. Thompson , Kyle R. Schwartz
CPC分类号： C08L63/00 , C08K3/14 , C08K3/22 , C08K3/38 , C08K7/20 , H05K5/02 , C08K2003/2227 , C08K2003/385 , C08K2201/001 , C08K2201/009
摘要： An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
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4.发明公开公开(公告)号：US20230323131A1
公开(公告)日：2023-10-12
申请号：US18024472
申请日：2021-09-03
发明人： Yongbeom Seo , Matthew H. Frey , Jacob P. Podkaminer , Victor Ho , Samuel J. Carpenter , Audrey S. Forticaux , Lalitha V. N. R. Ganapatibhotla , Taisiya Skorina , Jeremy M. Higgins , Yangbin Chen
CPC分类号： C09C1/407 , C09C3/06 , C01P2006/16
摘要： A decorated particle comprises a single inorganic particle core having an uneven outer surface with a plurality of crevices and an average particle diameter of 20 to 150 microns. A binder retaining decorating particles is disposed on at least a portion of the outer surface of the inorganic particle core and fills the crevices. The decorating particles have an average particle diameter of 0.05 to 10 microns. A method of making decorated particles is also disclosed.
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5.发明授权公开(公告)号：US11472992B2
公开(公告)日：2022-10-18
申请号：US16763168
申请日：2018-11-15
发明人： Derek J. Dehn , Clinton P. Waller, Jr. , Bharat R. Acharya , Brandon A. Bartling , Audrey S. Forticaux , Jeremy M. Higgins , Satinder K. Nayar
IPC分类号： C09K5/14 , B29C41/00 , B29C41/46 , C08K3/04 , C08K3/08 , C08K3/22 , C08K3/34 , C08K3/38 , B29K101/12
摘要： Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm3; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.
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6.发明授权公开(公告)号：US11773254B2
公开(公告)日：2023-10-03
申请号：US16756518
申请日：2018-12-21
发明人： Brett A. Beiermann , John C. Clark , Eric G. Larson , Jeremy M. Higgins , Audrey S. Forticaux , Jay R. Lomeda , Wayne S. Mahoney , Scott B. Charles , Timothy D. Fletcher , Wendy L. Thompson , Kyle R. Schwartz
CPC分类号： C08L63/00 , C08K3/14 , C08K3/22 , C08K3/38 , C08K7/20 , H05K5/02 , C08K2003/2227 , C08K2003/385 , C08K2201/001 , C08K2201/009
摘要： An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
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公开(公告)号：US11168193B2
公开(公告)日：2021-11-09
申请号：US17250400
申请日：2019-07-23
发明人： Audrey S. Forticaux , Joshua M. Fishman , Caitlin E. Meree , Ying Lin , Qin Lin , Carla S. Thomas , Duane D. Fansler , Jimmie R. Baran, Jr.
IPC分类号： C08J9/10 , C08F220/10 , C08K3/105 , C08K3/11 , C08F222/10 , C08F220/36 , C08J9/00 , C08K3/22 , C08K3/38 , C08K3/40 , C08K7/18
摘要： Reaction mixtures, foams prepared from the reaction mixtures, articles containing the foams, and methods of making the foams are provided. The polymeric material in the foam is formed from a polymerizable composition that includes a di(meth)acrylate oligomer and a monomer having a single ethylenically unsaturated group. The foams are highly filled (e.g., at least 60 volume percent of the foam is the filler) and can be thermally conductive. Although the foams contain a large amount of filler, the foams can be compressed at least 40 volume percent with an applied pressure of 50 pounds per square inch (345 kiloPascals).
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公开(公告)号：US20210253816A1
公开(公告)日：2021-08-19
申请号：US17250400
申请日：2019-07-23
发明人： Audrey S. Forticaux , Joshua M. Fishman , Caitlin E. Meree , Ying Lin , Qin Lin , Carla S. Thomas , Duane D. Fansler , Jimmie R. Baran, Jr.
IPC分类号： C08J9/10 , C08J9/00 , C08F222/10 , C08F220/36 , C08K3/38 , C08K3/22 , C08K3/40 , C08K3/11 , C08K3/105 , C08K7/18
摘要： Reaction mixtures, foams prepared from the reaction mixtures, articles containing the foams, and methods of making the foams are provided. The polymeric material in the foam is formed from a polymerizable composition that includes a di(meth)acrylate oligomer and a monomer having a single ethylenically unsaturated group. The foams are highly filled (e.g., at least 60 volume percent of the foam is the filler) and can be thermally conductive. Although the foams contain a large amount of filler, the foams can be compressed at least 40 volume percent with an applied pressure of 50 pounds per square inch (345 kiloPascals).
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