- 专利标题: SELF-ASSEMBLED MONOLAYER ON A DIELECTRIC FOR TRANSITION METAL DICHALCOGENIDE GROWTH FOR STACKED 2D CHANNELS
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申请号: US17850078申请日: 2022-06-27
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公开(公告)号: US20230420510A1公开(公告)日: 2023-12-28
- 发明人: Carl H. NAYLOR , Kirby MAXEY , Kevin P. O'BRIEN , Chelsey DOROW , Sudarat LEE , Ashish Verma PENUMATCHA , Uygar E. AVCI , Matthew V. METZ , Scott B. CLENDENNING , Jiun-Ruey CHEN , Chia-Ching LIN , Carly ROGAN
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/778 ; H01L29/786 ; H01L29/18 ; H01L21/02
摘要:
Embodiments described herein may be related to apparatuses, processes, and techniques directed to creating a transistor structure by selectively growing a 2D TMD directly in a stacked channel configuration, such as a stacked nanowire or nanoribbon formation. In embodiments, this TMD growth may occur for all of the nanowires or nanoribbons in the transistor structure in one stage. Placement of a SAM on a plurality of dielectric layers within the transistor structure stack facilitates channel deposition and channel geometry in the stacked channel configuration. Other embodiments may be described and/or claimed.
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