Invention Application
- Patent Title: BONDING APPARATUS AND BONDING METHOD
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Application No.: US17759517Application Date: 2021-01-21
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Publication No.: US20230086738A1Publication Date: 2023-03-23
- Inventor: Tokutarou HAYASHI , Yoshitaka OTSUKA , Yasutaka MIZOMOTO , Kazuya IKEUE , Munehisa KODAMA
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2020-011926 20200128
- International Application: PCT/JP2021/002053 WO 20210121
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/66 ; H01L21/68
Abstract:
A bonding apparatus is configured to bond a first substrate and a second substrate to prepare a combined substrate. The first substrate includes a base substrate, and a device layer formed on a surface of the base substrate facing the second substrate. The bonding apparatus includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a moving unit configured to move the first holder and the second holder relative to each other; and a total thickness measurement controller configured to control a thickness detector, which is configured to measure a total thickness of the combined substrate, to measure the total thickness at multiple points.
Public/Granted literature
- US1257075A Reproduction of sound characteristics. Public/Granted day:1918-02-19
Information query
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