公开(公告)号：US20180158796A1

公开(公告)日：2018-06-07

申请号：US15822364

申请日：2017-11-27

申请人： TOKYO ELECTRON LIMITED

发明人： Yoshitaka OTSUKA ,  Takashi NAKAMITSU ,  Yosuke OMORI ,  Kenji SUGAKAWA

IPC分类号： H01L23/00 ,  H01L21/683 ,  H01L21/677 ,  H01L21/67 ,  B32B37/10 ,  B32B41/00 ,  B32B37/00

CPC分类号： H01L24/75 ,  B32B15/01 ,  B32B37/0046 ,  B32B37/10 ,  B32B41/00 ,  B32B2041/04 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/68 ,  H01L21/6838 ,  H01L24/80 ,  H01L24/83 ,  H01L2224/7515 ,  H01L2224/753 ,  H01L2224/75302 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/7555 ,  H01L2224/7565 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75901 ,  H01L2224/75981 ,  H01L2224/75986 ,  H01L2224/80009 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83009 ,  H01L2224/83201 ,  H01L2224/83894 ,  H01L2224/83908

摘要： There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20190385973A1

公开(公告)日：2019-12-19

申请号：US16553530

申请日：2019-08-28

申请人： TOKYO ELECTRON LIMITED

发明人： Yoshitaka OTSUKA ,  Takashi NAKAMITSU ,  Yosuke OMORI ,  Kenji SUGAKAWA

IPC分类号： H01L23/00 ,  H01L21/683 ,  H01L21/67 ,  H01L21/677

摘要： There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20160296982A1

公开(公告)日：2016-10-13

申请号：US15089680

申请日：2016-04-04

申请人： TOKYO ELECTRON LIMITED

发明人： Osamu HIRAKAWA ,  Yoshitaka OTSUKA

IPC分类号： B08B7/04

CPC分类号： B08B7/04 ,  B08B3/02 ,  B08B5/02 ,  B08B5/04 ,  B08B13/00 ,  B08B15/04 ,  B08B2203/0229 ,  H01L21/67028 ,  H01L21/67253 ,  H01L21/67288

摘要： An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.

摘要翻译： 一种用于去除至少一种异物的设备包括：检测单元，其检测粘附到吸引保持单元的保持表面的至少一种异物，所述吸附保持单元构造成吸附和保持基底;去除单元，去除至少一种附着到 所述保持面使用流体;移动机构，其构造成移动所述检测单元和所述移除单元。

公开(公告)号：US20230086738A1

公开(公告)日：2023-03-23

申请号：US17759517

申请日：2021-01-21

申请人： Tokyo Electron Limited

发明人： Tokutarou HAYASHI ,  Yoshitaka OTSUKA ,  Yasutaka MIZOMOTO ,  Kazuya IKEUE ,  Munehisa KODAMA

IPC分类号： H01L21/67 ,  H01L21/66 ,  H01L21/68

摘要： A bonding apparatus is configured to bond a first substrate and a second substrate to prepare a combined substrate. The first substrate includes a base substrate, and a device layer formed on a surface of the base substrate facing the second substrate. The bonding apparatus includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a moving unit configured to move the first holder and the second holder relative to each other; and a total thickness measurement controller configured to control a thickness detector, which is configured to measure a total thickness of the combined substrate, to measure the total thickness at multiple points.

公开(公告)号：US20200343216A1

公开(公告)日：2020-10-29

申请号：US16928814

申请日：2020-07-14

申请人： TOKYO ELECTRON LIMITED

发明人： Yoshitaka OTSUKA ,  Takashi NAKAMITSU ,  Yosuke OMORI ,  Kenji SUGAKAWA

IPC分类号： H01L23/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  B32B15/01 ,  H01L21/18 ,  H01L21/20 ,  H01L21/68

摘要： There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20190105691A1

公开(公告)日：2019-04-11

申请号：US16210352

申请日：2018-12-05

申请人： TOKYO ELECTRON LIMITED

发明人： Osamu HIRAKAWA ,  Yoshitaka OTSUKA

IPC分类号： B08B7/04 ,  H01L21/67 ,  B08B3/02 ,  B08B5/04 ,  B08B13/00 ,  B08B5/02 ,  B08B15/04

摘要： An apparatus for removing at least one foreign substance includes a detection unit detecting the at least one foreign substance adhered to a holding surface of a suction holding unit configured to suck and hold a substrate, a removal unit removing the at least one foreign substance adhered to the holding surface using fluid, and a movement mechanism configured to move the detection unit and the removal unit.