- 专利标题: VERTICAL DIODES IN STACKED TRANSISTOR TECHNOLOGIES
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申请号: US17448373申请日: 2021-09-22
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公开(公告)号: US20230089395A1公开(公告)日: 2023-03-23
- 发明人: Benjamin Orr , Nicholas A. Thomson , Ayan Kar , Nathan D. Jack , Kalyan C. Kolluru , Patrick Morrow , Cheng-Ying Huang , Charles C. Kuo
- 申请人: INTEL CORPORATION
- 申请人地址: US CA Santa Clara
- 专利权人: INTEL CORPORATION
- 当前专利权人: INTEL CORPORATION
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L27/06
- IPC分类号: H01L27/06 ; H01L27/092 ; H01L29/66 ; H01L21/8238
摘要:
Integrated circuits including vertical diodes. In an example, a first transistor is above a second transistor. The first transistor includes a first semiconductor body extending laterally from a first source or drain region. The first source or drain region includes one of a p-type dopant or an n-type dopant. The second transistor includes a second semiconductor body extending laterally from a second source or drain region. The second source or drain region includes the other of the p-type dopant or the n-type dopant. The first source or drain region and second source or drain region are at least part of a diode structure, which may have a PN junction (e.g., first and second source/drain regions are merged) or a PIN junction (e.g., first and second source/drain regions are separated by an intrinsic semiconductor layer, or a dielectric layer and the first and second semiconductor bodies are part of the junction).
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