- 专利标题: GRAPHITIC CARBON CONTACTS FOR DEVICES WITH OXIDE CHANNELS
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申请号: US17478720申请日: 2021-09-17
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公开(公告)号: US20230102219A1公开(公告)日: 2023-03-30
- 发明人: Arnab Sen Gupta , Matthew V. Metz , Hui Jae Yoo , Justin R. Weber , Van H. Le , Jason C. Retasket , Abhishek A. Sharma , Noriyuki Sato , Yu-Jin Chen , Eric Mattson , Edward O. Johnson, JR.
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L29/45
- IPC分类号: H01L29/45 ; H01L29/786 ; H01L29/78 ; H01L29/66 ; H01L27/108 ; H01L29/417
摘要:
Described herein are integrated circuit devices with metal-oxide semiconductor channels and carbon source and drain (S/D) contacts. S/D contacts conduct current to and from the semiconductor devices, e.g., to the source and drain regions of a transistor. Carbon S/D contacts may be particularly useful with semiconductor devices that use certain channel materials, such as indium gallium zinc oxide.
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