The present invention is directed to a curable and electrochemically debondable adhesive composition comprising, based on the weight of the composition: from 40 to 99 wt. % of a) at least one ethylenically unsaturated non-ionic monomer; from 0.9 to 50 wt. % of b) at least one polymerizable ionic compound, wherein said polymerizable ionic compound comprises: b1) at least one compound in accordance with general formula IV; and/or b2) at least one compound in accordance with general formula V; and, from 0.1 to 10 wt. % of c) at least one free radical initiator.