公开(公告)号：US20230118005A1

公开(公告)日：2023-04-20

申请号：US18078152

申请日：2022-12-09

申请人： Henkel AG & Co. KGaA

发明人： Kang Wei Chou ,  Daniel Peral Crespo ,  Clara Anduix Cantó ,  Anna Maria Díaz Rovira ,  Alejandro Belmez Lledo ,  Víctor Pérez Padilla

IPC分类号： B08B7/00 ,  C09J7/10 ,  C09J11/04 ,  C09J11/08 ,  C09J179/04 ,  C09J5/06

摘要： The present invention is directed to a curable and electrochemically debondable adhesive composition comprising, based on the weight of the composition: from 40 to 99 wt. % of a) at least one ethylenically unsaturated non-ionic monomer; from 0.9 to 50 wt. % of b) at least one polymerizable ionic compound, wherein said polymerizable ionic compound comprises: b1) at least one compound in accordance with general formula IV; and/or b2) at least one compound in accordance with general formula V; and, from 0.1 to 10 wt. % of c) at least one free radical initiator.