Invention Application
- Patent Title: Lithography Apparatus and Method
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Application No.: US17691647Application Date: 2022-03-10
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Publication No.: US20230132074A1Publication Date: 2023-04-27
- Inventor: Wei-Chun Yen , Chi Yang , Sheng-Kang Yu , Shang-Chieh Chien , Li-Jui Chen , Heng-Hsin Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H05G2/00

Abstract:
In an embodiment, a method includes: heating a byproduct transport ring of an extreme ultraviolet source, the byproduct transport ring disposed beneath vanes of the extreme ultraviolet source; after heating the byproduct transport ring for a first duration, heating the vanes; after heating the vanes, cooling the vanes; and after cooling the vanes for a second duration, cooling the byproduct transport ring.
Public/Granted literature
- US12007694B2 Lithography apparatus and method Public/Granted day:2024-06-11
Information query
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