Invention Application
- Patent Title: MULTILAYER CAPACITOR
-
Application No.: US17712420Application Date: 2022-04-04
-
Publication No.: US20230135148A1Publication Date: 2023-05-04
- Inventor: Byung Woo KANG , Bon Seok KOO , Jung Min KIM , Ji Hye HAN , Hye Jin PARK , Sang Wook LEE , Hong Je CHOI
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0149608 20211103
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30

Abstract:
A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.
Public/Granted literature
- US11817267B2 Multilayer capacitor Public/Granted day:2023-11-14
Information query