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公开(公告)号：US20180286594A1
公开(公告)日：2018-10-04
申请号：US15661146
申请日：2017-07-27
发明人： Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Hae Sol KANG , Ji Hye HAN , Byung Woo KANG
摘要： A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.
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公开(公告)号：US20240194408A1
公开(公告)日：2024-06-13
申请号：US18132195
申请日：2023-04-07
发明人： Su Yun YUN , Hong Je CHOI , Ji Hye HAN , Byung Woo KANG , Hye Jin PARK , Sang Wook LEE , Jung Min KIM
CPC分类号： H01G4/2325 , H01G4/008 , H01G4/248 , H01G4/30
摘要： A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 μm or more, among the first conductive particles, and N2 is a total number of first conductive particles.
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公开(公告)号：US20230170147A1
公开(公告)日：2023-06-01
申请号：US17665462
申请日：2022-02-04
发明人： Hye Jin PARK , Bon Seok KOO , Jung Min KIM , Hong Je CHOI , Byung Woo KANG , Ji Hye HAN , Sang Wook LEE
摘要： A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.
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公开(公告)号：US20230119122A1
公开(公告)日：2023-04-20
申请号：US17682023
申请日：2022-02-28
发明人： Ji Hye HAN , Jung Min KIM , Byung Woo KANG , Hong Je CHOI , Hye Jin PARK , Sang Wook LEE , Bon Seok KOO , Jung Won LEE
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.
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公开(公告)号：US20190252123A1
公开(公告)日：2019-08-15
申请号：US16396054
申请日：2019-04-26
发明人： Jung Min KIM , Bon Seok KOO , Chang Hak CHOI , Hae Sol KANG , Ji Hye HAN , Byung Woo KANG
CPC分类号： H01G4/33 , H01G4/008 , H01G4/0085 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/248 , H01G4/30
摘要： A multilayer capacitor may have a decreased equivalent series resistance (ESR) and improved warpage strength and reliability with conductive resin layers of external electrodes on surfaces where internal electrodes are exposed from a body, intermetallic compounds are in contact with conductive connecting portions of the conductive resin layers and the internal electrodes, and conductive connecting portions are in contact with a plurality of metal particles and second electrode layers.
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公开(公告)号：US20190013150A1
公开(公告)日：2019-01-10
申请号：US15972860
申请日：2018-05-07
发明人： Kun Hoi KOO , Bon Seok KOO , Jung Min KIM , Jun Hyeon KIM , Hae Sol KANG , Soung Jin KIM , Ji Hye HAN , Byung Woo KANG , Chang Hak CHOI
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes, and external electrodes disposed on at least one surface of the body. The external electrodes each includes an electrode layer in contact with the first or second internal electrodes, an intermediate layer disposed on the electrode layer and including a first intermetallic compound, and a conductive resin layer disposed on the intermediate layer and including a plurality of metal particles, a second intermetallic compound and a base resin.
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公开(公告)号：US20180254138A1
公开(公告)日：2018-09-06
申请号：US15807001
申请日：2017-11-08
发明人： Kun Hoi KOO , Byung Woo KANG , Ji Hye HAN , Bon Seok KOO
CPC分类号： H01F27/2804 , H01F17/0013 , H01F17/04 , H01F27/29 , H01F27/292 , H01F2017/048 , H01F2027/2809
摘要： An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.
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公开(公告)号：US20240203656A1
公开(公告)日：2024-06-20
申请号：US18139443
申请日：2023-04-26
发明人： Hye Jin PARK , Hong Je CHOI , Ji Hye HAN , Byung Woo KANG , Su Yun YUN , Sang Wook LEE , Jung Min KIM
CPC分类号： H01G4/2325 , H01G4/30
摘要： An example embodiment of the present disclosure provides a multilayer electronic component including an external electrode including an electrode layer and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes conductive particles including at least one of Cu particles, Cu3Sn and Cu6Sn5, and a resin, and in cross-sections of the conductive resin layer, a ratio of an area occupied by Cu3Sn to the total area occupied by the Cu particles, Cu3Sn, and Cu6Sn5 is 1.88% to 38.89%, and a ratio of an area occupied by Cu6Sn5 to the total area occupied by the Cu particles, Cu3Sn and Cu6Sn5 is 31.54% to 97.23%.
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公开(公告)号：US20240177934A1
公开(公告)日：2024-05-30
申请号：US18368771
申请日：2023-09-15
发明人： Yoona PARK , Ji Hye HAN , Kangha LEE , Chul Seung LEE
摘要： A multilayer electronic component, in which a first external electrode may include a 1-2-th electrode layer including glass, and a 1-3-th electrode layer disposed on the first and second surfaces and a second external electrode may include a 2-2-th electrode layer including glass, and a 2-3-th electrode layer disposed on the first and second surfaces. In cross sections of the first and second external electrodes in the first and second directions, when an area fraction occupied by glass in the 1-2-th electrode layer is S1-2, an area fraction occupied by glass in the 1-3-th electrode layer is S1-3, an area fraction occupied by glass in the 2-2-th electrode layer is S2-2, and an area fraction occupied by glass in the 2-3-th electrode layer is S2-3, S1-2≥15%, S1-2≥S1-3, S2-2≥15%, S2-2>S2-3 are satisfied, thereby preventing cracks and improving moisture resistance reliability.
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公开(公告)号：US20240170219A1
公开(公告)日：2024-05-23
申请号：US18119391
申请日：2023-03-09
发明人： Byung Woo KANG , Jung Min KIM , Hong Je CHOI , Ji Hye HAN , Hye Jin PARK , Su Yun YUN , Sang Wook LEE
摘要： A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L1′≥L1 when L1 indicates a second-directional size of the resin layer in the band portion, and L1′ indicates a second-directional size of the conductive resin layer in the band portion.
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