公开(公告)号：US20240203656A1

公开(公告)日：2024-06-20

申请号：US18139443

申请日：2023-04-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin PARK ,  Hong Je CHOI ,  Ji Hye HAN ,  Byung Woo KANG ,  Su Yun YUN ,  Sang Wook LEE ,  Jung Min KIM

IPC: H01G4/232 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/30

Abstract: An example embodiment of the present disclosure provides a multilayer electronic component including an external electrode including an electrode layer and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes conductive particles including at least one of Cu particles, Cu3Sn and Cu6Sn5, and a resin, and in cross-sections of the conductive resin layer, a ratio of an area occupied by Cu3Sn to the total area occupied by the Cu particles, Cu3Sn, and Cu6Sn5 is 1.88% to 38.89%, and a ratio of an area occupied by Cu6Sn5 to the total area occupied by the Cu particles, Cu3Sn and Cu6Sn5 is 31.54% to 97.23%.

公开(公告)号：US20240170219A1

公开(公告)日：2024-05-23

申请号：US18119391

申请日：2023-03-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Woo KANG ,  Jung Min KIM ,  Hong Je CHOI ,  Ji Hye HAN ,  Hye Jin PARK ,  Su Yun YUN ,  Sang Wook LEE

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L1′≥L1 when L1 indicates a second-directional size of the resin layer in the band portion, and L1′ indicates a second-directional size of the conductive resin layer in the band portion.

公开(公告)号：US20230135148A1

公开(公告)日：2023-05-04

申请号：US17712420

申请日：2022-04-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byung Woo KANG ,  Bon Seok KOO ,  Jung Min KIM ,  Ji Hye HAN ,  Hye Jin PARK ,  Sang Wook LEE ,  Hong Je CHOI

IPC: H01G4/232 ,  H01G4/30

Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.

公开(公告)号：US20220093337A1

公开(公告)日：2022-03-24

申请号：US17233235

申请日：2021-04-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hye HAN ,  Jung Min KIM ,  Jae Seok YI ,  Hye Jin PARK ,  Byung Woo KANG ,  Jeong Ryeol KIM ,  Bon Seok KOO ,  Il Ro LEE

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H05K1/18 ,  H01G4/12

Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 μm or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.

公开(公告)号：US20240194408A1

公开(公告)日：2024-06-13

申请号：US18132195

申请日：2023-04-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Su Yun YUN ,  Hong Je CHOI ,  Ji Hye HAN ,  Byung Woo KANG ,  Hye Jin PARK ,  Sang Wook LEE ,  Jung Min KIM

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/248 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/008 ,  H01G4/248 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 μm or more, among the first conductive particles, and N2 is a total number of first conductive particles.

公开(公告)号：US20230170147A1

公开(公告)日：2023-06-01

申请号：US17665462

申请日：2022-02-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin PARK ,  Bon Seok KOO ,  Jung Min KIM ,  Hong Je CHOI ,  Byung Woo KANG ,  Ji Hye HAN ,  Sang Wook LEE

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/232 ,  H01G2/06 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/2325 ,  H01G2/065 ,  H01G4/12

Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.

公开(公告)号：US20230119122A1

公开(公告)日：2023-04-20

申请号：US17682023

申请日：2022-02-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hye HAN ,  Jung Min KIM ,  Byung Woo KANG ,  Hong Je CHOI ,  Hye Jin PARK ,  Sang Wook LEE ,  Bon Seok KOO ,  Jung Won LEE

IPC: H01G4/232 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.