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公开(公告)号：US20220208456A1
公开(公告)日：2022-06-30
申请号：US17338370
申请日：2021-06-03
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyo Yeol LEE , Seung Hun HAN , Sang Wook LEE , Jung Min KIM , Jeong Ryeol KIM
Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.
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公开(公告)号：US20190019624A1
公开(公告)日：2019-01-17
申请号：US15975198
申请日：2018-05-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Joon OH , Tae Joon PARK , Sang Wook LEE , Sung Min CHO , Seung Mo LIM
Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.
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公开(公告)号：US20240194408A1
公开(公告)日：2024-06-13
申请号：US18132195
申请日：2023-04-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Su Yun YUN , Hong Je CHOI , Ji Hye HAN , Byung Woo KANG , Hye Jin PARK , Sang Wook LEE , Jung Min KIM
CPC classification number: H01G4/2325 , H01G4/008 , H01G4/248 , H01G4/30
Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, first and second external electrodes respectively disposed on opposing surfaces of the body and connected to the first internal electrode, and a third external electrode disposed on the body, disposed between the first and second external electrodes and connected to the second internal electrode. One of the first and second external electrodes includes a first conductive resin layer, the first conductive resin layer includes first conductive particles including at least one of a first metal particle and a first intermetallic compound, and a first resin, and a ratio N1/N2 is 17% or more, in which N1 is the number of particles having a Feret diameter of 14 μm or more, among the first conductive particles, and N2 is a total number of first conductive particles.
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公开(公告)号：US20230170147A1
公开(公告)日：2023-06-01
申请号：US17665462
申请日：2022-02-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Jin PARK , Bon Seok KOO , Jung Min KIM , Hong Je CHOI , Byung Woo KANG , Ji Hye HAN , Sang Wook LEE
Abstract: A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes respectively disposed on the body, wherein the external electrode includes: a first electrode layer connected to the internal electrode; and a second electrode layer disposed on the first electrode layer, and including a conductive portion including an silver (Ag)-tin (Sn) alloy and a resin, and a ratio of an area of the Ag—Sn alloy to an area of the conductive portion satisfies 3 to 50% in at least a portion of a cross-section of the second electrode layer.
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公开(公告)号：US20230119122A1
公开(公告)日：2023-04-20
申请号：US17682023
申请日：2022-02-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hye HAN , Jung Min KIM , Byung Woo KANG , Hong Je CHOI , Hye Jin PARK , Sang Wook LEE , Bon Seok KOO , Jung Won LEE
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.
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Patent Agency Ranking
公开(公告)号：US20210233716A1
公开(公告)日：2021-07-29
申请号：US17230430
申请日：2021-04-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Dong Joon OH , Tae Joon PARK , Sang Wook LEE , Sung Min CHO , Seung Mo LIM
Abstract: A multilayer ceramic capacitor includes a body having a dielectric layer and internal electrodes disposed to be alternately exposed to the third and fourth surfaces with the dielectric layer interposed therebetween. External electrodes include connection parts respectively formed on opposing surfaces of the body, band parts formed to extend from the connection parts to portions of side surfaces of the body, and corner parts in which the connection parts and the band parts are contiguous. A thickness of each of the external electrodes may be 50 nm to 2 μm. The external electrodes may be formed using a barrel-type sputtering method. A ratio t2/t1 may satisfy 0.7 to 1.2, where t1 is a thickness of each connection part and t2 is a thickness of each band part. A ratio t3/t1 may satisfy 0.7 to 1.0, where t3 is a thickness of each corner part.
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公开(公告)号：US20240203656A1
公开(公告)日：2024-06-20
申请号：US18139443
申请日：2023-04-26
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hye Jin PARK , Hong Je CHOI , Ji Hye HAN , Byung Woo KANG , Su Yun YUN , Sang Wook LEE , Jung Min KIM
CPC classification number: H01G4/2325 , H01G4/30
Abstract: An example embodiment of the present disclosure provides a multilayer electronic component including an external electrode including an electrode layer and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes conductive particles including at least one of Cu particles, Cu3Sn and Cu6Sn5, and a resin, and in cross-sections of the conductive resin layer, a ratio of an area occupied by Cu3Sn to the total area occupied by the Cu particles, Cu3Sn, and Cu6Sn5 is 1.88% to 38.89%, and a ratio of an area occupied by Cu6Sn5 to the total area occupied by the Cu particles, Cu3Sn and Cu6Sn5 is 31.54% to 97.23%.
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公开(公告)号：US20240170219A1
公开(公告)日：2024-05-23
申请号：US18119391
申请日：2023-03-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo KANG , Jung Min KIM , Hong Je CHOI , Ji Hye HAN , Hye Jin PARK , Su Yun YUN , Sang Wook LEE
Abstract: A multilayer electronic component includes: a body having a dielectric layer and first and second internal electrodes alternately disposed with each other while having the dielectric layer interposed therebetween in a first direction; and an external electrode including a connection portion and a band portion extending from the connection portion onto first and second surfaces of the body, wherein the external electrode further includes an electrode layer connected to one of the first and second internal electrodes, a resin layer in contact with the first and second surfaces, and a conductive resin layer disposed on the electrode layer and extending to the resin layer, and L1′≥L1 when L1 indicates a second-directional size of the resin layer in the band portion, and L1′ indicates a second-directional size of the conductive resin layer in the band portion.
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公开(公告)号：US20230135148A1
公开(公告)日：2023-05-04
申请号：US17712420
申请日：2022-04-04
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byung Woo KANG , Bon Seok KOO , Jung Min KIM , Ji Hye HAN , Hye Jin PARK , Sang Wook LEE , Hong Je CHOI
Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.
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公开(公告)号：US20210375546A1
公开(公告)日：2021-12-02
申请号：US17016799
申请日：2020-09-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jeong Suong YANG , Bon Seok KOO , Sang Wook LEE , Jung Min KIM , Sung Min CHO
Abstract: An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.
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