Invention Publication
- Patent Title: SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT
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Application No.: US18177300Application Date: 2023-03-02
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Publication No.: US20240047253A1Publication Date: 2024-02-08
- Inventor: Sangho JANG , Dongsoo LEE , Kibeom KIL , Yeongseok KIM , Wooram OH , Youngshin CHOI
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20220097518 2022.08.04
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65G47/90 ; H01L21/67 ; H05K13/00

Abstract:
A substrate loading apparatus includes a pickup apparatus configured to move a magazine in a first direction, a second direction and a third direction, an elevator defining a plurality of waiting spaces, a stage configured to support the magazine, and an insert apparatus configured to transfer substrates in the magazine. At least one of the plurality of waiting spaces of the elevator is configured to selectively receive the magazine, and the pickup apparatus is spaced apart from the elevator and the stage in the third direction.
Information query
IPC分类: