公开(公告)号：US20220246491A1

公开(公告)日：2022-08-04

申请号：US17726916

申请日：2022-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Myung-Sung KANG ,  Yeongseok KIM ,  Gwangsun SEO ,  Hyein YOO ,  Yongwon CHOI

IPC: H01L23/373 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  C09J7/28 ,  C09J11/04

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20240047253A1

公开(公告)日：2024-02-08

申请号：US18177300

申请日：2023-03-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangho JANG ,  Dongsoo LEE ,  Kibeom KIL ,  Yeongseok KIM ,  Wooram OH ,  Youngshin CHOI

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/67 ,  H05K13/00

CPC classification number: H01L21/6773 ,  H01L21/67736 ,  H01L21/67742 ,  B65G47/901 ,  H01L21/67757 ,  H01L21/67144 ,  H05K13/0061

Abstract: A substrate loading apparatus includes a pickup apparatus configured to move a magazine in a first direction, a second direction and a third direction, an elevator defining a plurality of waiting spaces, a stage configured to support the magazine, and an insert apparatus configured to transfer substrates in the magazine. At least one of the plurality of waiting spaces of the elevator is configured to selectively receive the magazine, and the pickup apparatus is spaced apart from the elevator and the stage in the third direction.

公开(公告)号：US20220384238A1

公开(公告)日：2022-12-01

申请号：US17677442

申请日：2022-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seonho LEE ,  Yeongseok KIM

IPC: H01L21/683 ,  C09J7/38 ,  C09J7/35 ,  B32B27/30 ,  B32B27/32

Abstract: A debonding tape includes a first tape layer including a first base layer having a first modulus and a first adhesive layer on the first base layer, wherein the first tape layer has a first diameter. The debonding tape includes a second tape layer on the first tape layer and supporting the first tape layer, wherein the second tape layer includes a second base layer on the first adhesive layer and having a second modulus greater than the first modulus, an intermediate layer on the second base layer, and a second adhesive layer on the intermediate layer. The second tape layer has a second diameter smaller than the first diameter such that a circumferential portion of the first tape layer is exposed in a cross-sectional view.

公开(公告)号：US20170179098A1

公开(公告)日：2017-06-22

申请号：US15355476

申请日：2016-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyein YOO ,  Yeongseok KIM

IPC: H01L25/00 ,  H01L23/31 ,  H01L21/78 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/552 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor chips on a substrate in a stripped state, forming a mold layer to cover the semiconductor chips, cutting the mold layer and the substrate to form unit packages separated from each other, and forming a shielding layer on the mold layer of each of the unit packages, wherein each of the unit packages includes a corresponding one of the semiconductor chips, wherein the mold layer in each of the unit packages includes side surfaces, a top surface, and corner regions, and wherein each of the corner regions of the mold layer includes a first corner, which is connected to a corresponding one of the side surfaces and has a first curvature radius, and a second corner, which is connected to the top surface and has a second curvature radius smaller than the first curvature radius.

公开(公告)号：US20220367401A1

公开(公告)日：2022-11-17

申请号：US17540519

申请日：2021-12-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunyeong KIM ,  Yeongseok KIM ,  Jihwan HWANG

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L23/498

Abstract: A semiconductor package including a base chip; a semiconductor chip having a lower surface on which connection pads are disposed, the semiconductor chip being mounted on an upper surface of the base chip; a plurality of bumps on the connection pads and electrically connecting the base chip to the semiconductor chip; an adhesive film between the base chip and the semiconductor chip and fixing the semiconductor chip to the base chip; and an encapsulant on the base chip and encapsulating the semiconductor chip, wherein the semiconductor chip includes a central portion spaced apart from the upper surface of the base chip by a first distance, and an edge portion spaced apart from the upper surface of the base chip by a second distance, the edge portion being outside of the central portion, and a ratio of the second distance to the first distance is about 0.8 to about 1.0.

公开(公告)号：US20200211920A1

公开(公告)日：2020-07-02

申请号：US16540495

申请日：2019-08-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joungphil LEE ,  Myung-Sung KANG ,  Yeongseok KIM ,  Gwangsun SEO ,  Hyein YOO ,  Yongwon CHOI

IPC: H01L23/373 ,  H01L23/31 ,  H01L23/29 ,  H01L23/00

Abstract: An adhesive film includes a porous metal layer having a plurality of pores therein, a first adhesive layer on one side of the porous metal layer, an adhesive substance at least partially filling the pores of the porous metal layer, and a plurality of first thermal conductive members distributed in the first adhesive layer.

公开(公告)号：US20180158810A1

公开(公告)日：2018-06-07

申请号：US15889957

申请日：2018-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyein YOO ,  Yeongseok KIM

IPC: H01L25/00 ,  H01L21/78 ,  H01L23/31 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3128 ,  H01L23/552 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00

Abstract: A method of fabricating a semiconductor package includes mounting a plurality of semiconductor chips on a substrate in a stripped state, forming a mold layer to cover the semiconductor chips, cutting the mold layer and the substrate to form unit packages separated from each other, and forming a shielding layer on the mold layer of each of the unit packages, wherein each of the unit packages includes a corresponding one of the semiconductor chips, wherein the mold layer in each of the unit packages includes side surfaces, a top surface, and corner regions, and wherein each of the corner regions of the mold layer includes a first corner, which is connected to a corresponding one of the side surfaces and has a first curvature radius, and a second corner, which is connected to the top surface and has a second curvature radius smaller than the first curvature radius.