公开(公告)号：US20240047253A1

公开(公告)日：2024-02-08

申请号：US18177300

申请日：2023-03-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangho JANG ,  Dongsoo LEE ,  Kibeom KIL ,  Yeongseok KIM ,  Wooram OH ,  Youngshin CHOI

IPC: H01L21/677 ,  B65G47/90 ,  H01L21/67 ,  H05K13/00

CPC classification number: H01L21/6773 ,  H01L21/67736 ,  H01L21/67742 ,  B65G47/901 ,  H01L21/67757 ,  H01L21/67144 ,  H05K13/0061

Abstract: A substrate loading apparatus includes a pickup apparatus configured to move a magazine in a first direction, a second direction and a third direction, an elevator defining a plurality of waiting spaces, a stage configured to support the magazine, and an insert apparatus configured to transfer substrates in the magazine. At least one of the plurality of waiting spaces of the elevator is configured to selectively receive the magazine, and the pickup apparatus is spaced apart from the elevator and the stage in the third direction.

公开(公告)号：US20240321618A1

公开(公告)日：2024-09-26

申请号：US18610612

申请日：2024-03-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suhwan SHIM ,  Sungchul KIM ,  Sangho JANG ,  Youngshin CHOI

IPC: H01L21/68 ,  H01L21/66 ,  H01L21/67 ,  H01L21/673 ,  H01L21/683

CPC classification number: H01L21/681 ,  H01L21/67259 ,  H01L21/67333 ,  H01L21/6838 ,  H01L22/20

Abstract: A semiconductor manufacturing apparatus includes a semiconductor package. A tray has the semiconductor package seated thereon. An inspector inspects an alignment state of the semiconductor package. A protrusion is on a top surface of the tray and extends in a Z direction that is a vertical direction. The protrusion surrounds a side surface of the semiconductor package when the semiconductor package is in an aligned state. The semiconductor package overlaps at least a portion of the protrusion in the Z direction when the semiconductor package is in a misaligned state. An under vision camera detects a rotation angle of the semiconductor package with respect to an X-Y plane defined in a first horizontal direction X and a second horizontal direction Y that cross the Z direction. A picker moves the semiconductor package between the tray and an area above the under vision camera.