- 专利标题： CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY
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申请号： US17889238申请日： 2022-08-16
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公开(公告)号： US20240063127A1公开(公告)日： 2024-02-22
- 发明人: Jeremy D. ECTON , Brandon C. MARIN , Srinivas V. PIETAMBARAM , Gang DUAN , Suddhasattwa NAD
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/498 ; H01L23/13 ; H01L23/15 ; H01L23/00 ; H01L25/065
摘要：
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate with a cavity, where the first substrate comprises glass. In an embodiment, a second substrate is in the cavity. In an embodiment, a bond film covers a bottom of the second substrate and extends up sidewalls of the second substrate.
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