A method of manufacturing a substrate with chips includes the following (A) and (B):



(A) preparing a stacked substrate, the stacked substrate including: a plurality of chips; a first substrate to which the plurality of chips are temporarily bonded; and a second substrate bonded to the first substrate via the plurality of chips; and
(B) separating the plurality of chips bonded to the first substrate and the second substrate, from the first substrate, in order to bond the plurality of chips to one surface of a third substrate including a device layer.




In this method, the first substrate, from which the plurality of chips are separated, includes alignment marks that are used to ensure alignment when the first substrate and the plurality of chips are bonded together, or that are used to measure misalignment after the first substrate and the plurality of chips are bonded together.