Methods, apparatus, systems, and articles of manufacture utilizing conjugated polymers in integrated circuit packages with glass substrates are disclosed. A disclosed integrated circuit (IC) package includes: a glass substrate; a first electrode; an organic material; and a second electrode. The first electrode is between the glass substrate and the organic material. The organic material includes at least one of a conjugated polymer or a metal-organic supramolecule. The organic material is between the first electrode and the second electrode.