公开(公告)号：US20230298971A1

公开(公告)日：2023-09-21

申请号：US17699031

申请日：2022-03-18

Applicant: Intel Corporation

Inventor： Shayan Kaviani ,  Darko Grujicic ,  Suddhasattwa Nad ,  Miranda Ngan

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/145 ,  H01L21/486 ,  H01L24/16 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/16145

Abstract: A microelectronic structure and a method of forming same. The microelectronic structure includes: a core substrate including one of a glass material or an organic material, and defining a plurality of trenches therein; electrically conductive vias extending within the trenches, the vias to provide electrical coupling through the core substrate to semiconductor packages to be attached to the core substrate, individual ones of the vias including: a trench liner adjacent walls of a corresponding one of the plurality of trenches, the trench liner including an electrically conductive polymer material having double carbon bonds; and a metal structure on the trench liner.

公开(公告)号：US12165994B2

公开(公告)日：2024-12-10

申请号：US17024307

申请日：2020-09-17

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Kristof Darmawikarta ,  Benjamin Duong ,  Telesphor Kamgaing ,  Miranda Ngan ,  Srinivas Pietambaram

IPC: H01L25/065 ,  H01L23/66 ,  H01L25/00 ,  H01P3/08 ,  H01Q1/22 ,  H05K1/02

Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.

公开(公告)号：US20240107784A1

公开(公告)日：2024-03-28

申请号：US17954917

申请日：2022-09-28

Applicant: Intel Corporation

Inventor： Shayan Kaviani ,  Benjamin Duong ,  Miranda Ngan ,  Mahdi Mohammadighaleni

IPC: H01L51/44

CPC classification number: H01L51/448

Abstract: Methods, apparatus, systems, and articles of manufacture utilizing conjugated polymers in integrated circuit packages with glass substrates are disclosed. A disclosed integrated circuit (IC) package includes: a glass substrate; a first electrode; an organic material; and a second electrode. The first electrode is between the glass substrate and the organic material. The organic material includes at least one of a conjugated polymer or a metal-organic supramolecule. The organic material is between the first electrode and the second electrode.

公开(公告)号：US20240096561A1

公开(公告)日：2024-03-21

申请号：US17948586

申请日：2022-09-20

Applicant: Intel Corporation

Inventor： Mahdi Mohammadighaleni ,  Benjamin Duong ,  Shayan Kaviani ,  Joshua Stacey ,  Miranda Ngan ,  Dilan Seneviratne ,  Thomas Heaton ,  Srinivas Venkata Ramanuja Pietambaram ,  Whitney Bryks ,  Jieying Kong

IPC: H01G4/33 ,  H01G4/012

CPC classification number: H01G4/33 ,  H01G4/012 ,  H01L28/92 ,  H01L25/16

Abstract: An apparatus, system, and method for in-situ three-dimensional (3D) thin-film capacitor (TFC) are provided. A 3D TFC can include a glass core, a through glass via (TGV) in the glass core including first conductive material, the first conductive material forming a first electrode of the 3D MIM capacitor, a second conductive material acting as a second electrode of the 3D MIM capacitor, and a dielectric material in contact with the first and second conductive materials, the dielectric material extending vertically and horizontally and physically separating the first and second conductive materials.

公开(公告)号：US20220084962A1

公开(公告)日：2022-03-17

申请号：US17024307

申请日：2020-09-17

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Kristof Darmawikarta ,  Benjamin Duong ,  Telesphor Kamgaing ,  Miranda Ngan ,  Srinivas Pietambaram

IPC: H01L23/66 ,  H05K1/02 ,  H01P3/08 ,  H01Q1/22 ,  H01L25/065 ,  H01L25/00

Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.