公开(公告)号：US20240186136A1

公开(公告)日：2024-06-06

申请号：US18061126

申请日：2022-12-02

申请人： Intel Corporation

发明人： Mahdi Mohammadighaleni ,  Whitney M. Bryks ,  Shayan Kaviani ,  Joshua J. Stacey ,  Thomas S. Heaton

IPC分类号： H01L21/02 ,  C23C16/02

CPC分类号： H01L21/0212 ,  C23C16/0209 ,  C23C16/0272 ,  H01L21/02422 ,  H01L21/0262

摘要： In one embodiment, an integrated circuit apparatus (e.g., package substrate) includes a polymeric layer between a metal and a dielectric or between a metal and a glass. The polymeric layer may be conformally deposited using a vacuum-based vapor deposition technique, e.g., initiated chemical vapor deposition (iCVD).

公开(公告)号：US20240096561A1

公开(公告)日：2024-03-21

申请号：US17948586

申请日：2022-09-20

申请人： Intel Corporation

发明人： Mahdi Mohammadighaleni ,  Benjamin Duong ,  Shayan Kaviani ,  Joshua Stacey ,  Miranda Ngan ,  Dilan Seneviratne ,  Thomas Heaton ,  Srinivas Venkata Ramanuja Pietambaram ,  Whitney Bryks ,  Jieying Kong

IPC分类号： H01G4/33 ,  H01G4/012

CPC分类号： H01G4/33 ,  H01G4/012 ,  H01L28/92 ,  H01L25/16

摘要： An apparatus, system, and method for in-situ three-dimensional (3D) thin-film capacitor (TFC) are provided. A 3D TFC can include a glass core, a through glass via (TGV) in the glass core including first conductive material, the first conductive material forming a first electrode of the 3D MIM capacitor, a second conductive material acting as a second electrode of the 3D MIM capacitor, and a dielectric material in contact with the first and second conductive materials, the dielectric material extending vertically and horizontally and physically separating the first and second conductive materials.

公开(公告)号：US20230298971A1

公开(公告)日：2023-09-21

申请号：US17699031

申请日：2022-03-18

申请人： Intel Corporation

发明人： Shayan Kaviani ,  Darko Grujicic ,  Suddhasattwa Nad ,  Miranda Ngan

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/145 ,  H01L21/486 ,  H01L24/16 ,  H01L25/0652 ,  H01L2224/16225 ,  H01L2224/16145

摘要： A microelectronic structure and a method of forming same. The microelectronic structure includes: a core substrate including one of a glass material or an organic material, and defining a plurality of trenches therein; electrically conductive vias extending within the trenches, the vias to provide electrical coupling through the core substrate to semiconductor packages to be attached to the core substrate, individual ones of the vias including: a trench liner adjacent walls of a corresponding one of the plurality of trenches, the trench liner including an electrically conductive polymer material having double carbon bonds; and a metal structure on the trench liner.

公开(公告)号：US20240113048A1

公开(公告)日：2024-04-04

申请号：US17957590

申请日：2022-09-30

申请人： Intel Corporation

发明人： Srinivasan Raman ,  Benjamin Duong ,  Jason Scott Steill ,  Shayan Kaviani ,  Srinivas Venkata Ramanuja Pietambaram ,  Suddhasattwa Nad ,  Brandon C. Marin ,  Gang Duan ,  Yi Yang

IPC分类号： H01L23/64 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498

CPC分类号： H01L23/647 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866

摘要： Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.

公开(公告)号：US20240107784A1

公开(公告)日：2024-03-28

申请号：US17954917

申请日：2022-09-28

申请人： Intel Corporation

发明人： Shayan Kaviani ,  Benjamin Duong ,  Miranda Ngan ,  Mahdi Mohammadighaleni

IPC分类号： H01L51/44

CPC分类号： H01L51/448

摘要： Methods, apparatus, systems, and articles of manufacture utilizing conjugated polymers in integrated circuit packages with glass substrates are disclosed. A disclosed integrated circuit (IC) package includes: a glass substrate; a first electrode; an organic material; and a second electrode. The first electrode is between the glass substrate and the organic material. The organic material includes at least one of a conjugated polymer or a metal-organic supramolecule. The organic material is between the first electrode and the second electrode.

公开(公告)号：US20240222018A1

公开(公告)日：2024-07-04

申请号：US18147503

申请日：2022-12-28

申请人： Intel Corporation

发明人： Thomas Sounart ,  Henning Braunisch ,  Aleksandar Aleksov ,  Kristof Darmawikarta ,  Numair Ahmed ,  Darko Grujicic ,  Suddhasattwa Nad ,  Benjamin Duong ,  Marcel Wall ,  Shayan Kaviani

IPC分类号： H01G4/01 ,  H01G4/30 ,  H01G4/33 ,  H01L21/48 ,  H01L23/538

CPC分类号： H01G4/01 ,  H01G4/306 ,  H01G4/33 ,  H01L21/4846 ,  H01L23/5386 ,  H01L28/87 ,  H01L28/92 ,  H01G4/008

摘要： Substrate package-integrated oxide capacitors and related methods are disclosed herein. An example apparatus including a first layer and a thin film capacitor including a second layer on the first layer, the second layer defining a plurality of openings and a third layer disposed on the first layer and in the plurality of openings, the second layer and the third layer corresponding to electrodes of a capacitor and a fourth layer disposed between the first layer and the second layer, the third layer including an oxidized material, the third layer forming a dielectric of the capacitor.

公开(公告)号：US20240113046A1

公开(公告)日：2024-04-04

申请号：US17957257

申请日：2022-09-30

申请人： Intel Corporation

发明人： Jason Scott Steill ,  Shayan Kaviani ,  Srinivas Venkata Ramanuja Pietambaram ,  Suddhasattwa Nad ,  Benjamin Duong ,  Srinivasan Raman ,  Yi Yang

IPC分类号： H01L23/62 ,  H01L21/48 ,  H01L23/00 ,  H01L23/15 ,  H01L23/498 ,  H01L23/64

CPC分类号： H01L23/62 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/645 ,  H01L23/647 ,  H01L24/24 ,  H01L2224/24145 ,  H01L2924/12036

摘要： Various embodiments disclosed relate to embedded components in glass core layers for semiconductor assemblies. The present disclosure includes a semiconductor assembly with a glass core having one or more cavities and a component embedded into the glass core at the one or more cavities portion, the component at least partially embedded in the glass core, and a semiconductor die attached to the substrate.