Invention Publication
- Patent Title: HYBRID PLASMONIC WAVEGUIDE AND METHOD FOR HIGH DENSITY PACKAGING INTEGRATED WITH A GLASS INTERPOSER
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Application No.: US17957600Application Date: 2022-09-30
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Publication No.: US20240111095A1Publication Date: 2024-04-04
- Inventor: Hiroki Tanaka , Brandon C. Marin , Robert Alan May , Suddhasattwa Nad , Benjamin Duong
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G02B6/122
- IPC: G02B6/122

Abstract:
A hybrid plasmonic waveguide and associated methods are disclosed. In one example, the electronic device includes combining an electromagnetic wave propagating in a waveguide with a high refractive index and a surface plasmon from a metal surface to create a hybrid plasmon wave in a low refractive index material separating the dielectric waveguide and metal surface. In selected examples, surface mounted hybrid plasmonic waveguides are shown. In selected examples hybrid plasmonic waveguides embedded in glass interposers are shown.
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