Invention Publication
- Patent Title: INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS RECESSED FOR GATE CONTACT
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Application No.: US17956779Application Date: 2022-09-29
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Publication No.: US20240113111A1Publication Date: 2024-04-04
- Inventor: Leonard P. GULER , Clifford ONG , Sukru YEMENICIOGLU , Tahir GHANI
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/08 ; H01L29/786

Abstract:
Integrated circuit structures having fin isolation regions recessed for gate contact are described. In an example, an integrated circuit structure includes a vertical stack of horizontal nanowires over a first sub-fin. A gate structure is over the vertical stack of horizontal nanowires and on the first sub-fin. A dielectric structure is laterally spaced apart from the gate structure. The dielectric structure is not over a channel structure but is on a second sub-fin. A dielectric gate cut plug is between the gate structure and the dielectric structure. A recess is in the dielectric structure and in the dielectric gate cut plug. A conductive structure is in the recess, the conductive structure in lateral contact with a gate electrode of the gate structure.
Information query
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