Various 3D array structures and processes are disclosed. In an embodiment, a word line staircase structure is provided that includes a plurality of word line layers alternately deposited with a plurality of insulating layers to form a stack and a first word line stairstep that includes all the layers of the stack. The staircase structure also includes one or more additional word line stairsteps such that each successive additional word line stairstep is formed to include less layers of the stack than the preceding word line stairstep to form the word line staircase structure. The stairstep structure also includes multiple contact holes formed in each word line stairstep to contact multiple word line layers within that word line stairstep.