Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE HAVING DOPED EPITAXIAL REGION AND ITS METHODS OF FABRICATION
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Application No.: US18407007Application Date: 2024-01-08
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Publication No.: US20240145592A1Publication Date: 2024-05-02
- Inventor: Anand S. MURTHY , Daniel Boune AUBERTINE , Tahir GHANI , Abhijit Jayant PETHE
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- The original application number of the division: US17161534 2021.01.28
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L29/08 ; H01L29/165 ; H01L29/66

Abstract:
Embodiments of the present invention describe a epitaxial region on a semiconductor device. In one embodiment, the epitaxial region is deposited onto a substrate via cyclical deposition-etch process. Cavities created underneath the spacer during the cyclical deposition-etch process are backfilled by an epitaxial cap layer. The epitaxial region and epitaxial cap layer improves electron mobility at the channel region, reduces short channel effects and decreases parasitic resistance.
Public/Granted literature
- US12294027B2 Semiconductor device having doped epitaxial region and its methods of fabrication Public/Granted day:2025-05-06
Information query
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