Invention Publication
- Patent Title: FILMS FOR MULTIPLE LAYERS ASSEMBLIES
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Application No.: US18547448Application Date: 2022-02-22
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Publication No.: US20240149575A1Publication Date: 2024-05-09
- Inventor: Chantal Louis , James Francis Pratte , Mohammad Jamal El-Hibri , Yiqiang Zhao
- Applicant: SOLVAY SPECIALTY POLYMERS USA, LLC , Cytec Industries Inc.
- Applicant Address: US GA Alpharetta
- Assignee: SOLVAY SPECIALTY POLYMERS USA, LLC,Cytec Industries Inc.
- Current Assignee: SOLVAY SPECIALTY POLYMERS USA, LLC,Cytec Industries Inc.
- Current Assignee Address: US GA Alpharetta; US NJ Princeton
- Priority: EP 181639.2 2021.06.25
- International Application: PCT/EP2022/054442 2022.02.22
- Date entered country: 2023-08-22
- Main IPC: B32B27/28
- IPC: B32B27/28 ; B32B5/02 ; B32B5/26 ; B32B27/12 ; B32B27/26 ; B32B37/04 ; B32B37/20

Abstract:
The present invention relates to assembly comprising a first component and a second component, each component comprising a polymer, as well as a film positioned between and bonded to the first component and the second component. The film is such that it comprises a blend of at least two poly(ether ketone ketone) (PEKK) polymers and optionally at least one nucleating agent. The assembly has an improved fracture toughness and overall good mechanical properties.
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