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公开(公告)号：US20240262962A1
公开(公告)日：2024-08-08
申请号：US18560658
申请日：2022-05-11
发明人： Arthur Bertrand , Stéphane Jeol , Joel Flores
CPC分类号： C08G69/265 , C08L77/06
摘要： Described herein are amorphous and transparent aliphatic polyamides (PA) formed from the polycondensation of monomers in a reaction mixture (RM) including a dicarboxylic acid component (DC) and a diamine component (DA). The dicarboxylic acid component (DC) includes 25 mol % to 80 mol % of 1,4-cyclohexane dicarboxylic acid (“1,4-CHDA”) and 20 mol % to 75 mol % of a linear, aliphatic dicarboxylic acid selected from azelaic acid, sebacic acid or a combination thereof. The diamine component (DA) includes a cycloaliphatic diamine selected from the group consisting of isophoronediamine (“IPDA”); 4,4′-methyl-enebis(2-methylcyclohexylamine) (“MACM”); 4,4′-methylene-bis-cyclohexane (“PACM”); 1,3-bis(aminomethyl)cyclohexane (“1,3-BAC”), bis(aminomethyl)norborane (“BAMN”) and any combination of two or more thereof. It was surprisingly found that the polyamides (PA), while being bio-based (at least in part due to the linear aliphatic dicarboxylic acid), had excellent optical clarity, improved UV stability and desirably high Tg.
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公开(公告)号：US20240150531A1
公开(公告)日：2024-05-09
申请号：US18547230
申请日：2022-02-18
发明人： Nicolas Treat , Joel Pollino , Ryan Mondschein , David B. Thomas
CPC分类号： C08J5/18 , H10K59/87 , C08J2365/02
摘要： The present invention relates to hard optically transparent films suitable as protective films for displays, in particular flexible OLED displays.
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3.发明公开公开(公告)号：US20240052163A1
公开(公告)日：2024-02-15
申请号：US18264440
申请日：2022-02-22
发明人： Lindsey ANDERSON , Benjamin RECK , Vijay GOPALAKRISHNAN , Chinomso NWOSU , Raleigh L. DAVIS , Matthew VINCENT
CPC分类号： C08L77/06 , C08K7/14 , C08L2203/30
摘要： Described herein are polymer compositions including a polyphthalamide having a carbon/amide molar ratio greater than 8, a functionalized polyolefin, and a glass fiber, where the weight ratio of the functionalized polyolefin to the total weight of the polyphthalamide and the functionalized polyolefin in the polymer composition is more than 0 and at most 27%. It was surprisingly discovered that the polymer compositions had excellent dielectric performance, acid resistance, and improved mechanical performance, particularly tensile elongation and un-notched Izod impact, relative to corresponding polymer compositions omitting such functionalized polyolefin. Due to the excellent performance, the polymer composition can be desirably incorporated into mobile electronic device components.
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公开(公告)号：US20240043638A1
公开(公告)日：2024-02-08
申请号：US18258036
申请日：2021-12-16
发明人： Glenn P. Desio , Lewis Williams
CPC分类号： C08J5/249 , B32B27/08 , B32B5/12 , B32B5/024 , B32B27/285 , B32B27/34 , C08J5/243 , C08J5/244 , B32B2262/101 , B32B2262/106 , B32B2262/105 , B32B2264/0271 , B32B2307/516 , B32B2307/52 , C08J2423/08
摘要： Multilayer composites laminates comprising continuous fibers and a polymer matrix including a thermoplastic polymer and an impact modifier are disclosed. The invention further relates to articles incorporating the thermoplastic composites laminate.
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公开(公告)号：US20230340203A1
公开(公告)日：2023-10-26
申请号：US17998774
申请日：2021-05-12
发明人： Eduardo Soriano , Joel Pollino , Kermit S. Kwan , Clay Bradley Arrington , Viswanath Meenakshisundaram , Timothy Edward Long , Christopher Bryant Williams , Daniel Andrew Rau
IPC分类号： C08G73/14 , C08G73/10 , B29C64/129
CPC分类号： C08G73/14 , C08G73/1025 , C08G73/1071 , B29C64/129 , B29K2079/085
摘要： The present invention relates to poly(amide imide) (PAI) precursor polymers which can for example be used in Vat photopolymerization processes like lithographic processes for the photofabrication of three-dimensional (3D) articles. The invention further relates to polymer compositions including these poly(amide imide) (PAI) precursor polymers. Still further, the invention relates to vat photopolymerization methods to form three-dimensional (3D) objects that incorporate the aforementioned polymer compositions.
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公开(公告)号：US20230331979A1
公开(公告)日：2023-10-19
申请号：US18009678
申请日：2021-06-04
CPC分类号： C08L61/02 , C08J5/042 , B32B5/02 , B32B5/26 , B29C71/02 , B29C70/003 , C08L2205/16 , C08L2205/025 , C08J2361/02 , B32B2262/106 , B32B2260/021 , B32B2260/046 , B32B2307/542 , B32B2307/54 , B29C70/38
摘要： Fiber reinforced composite material comprising a thermoplastic matrix comprising blends of poly(ether ketone ketone) (PEKK) polymers, their method of manufacture and articles obtained therefrom.
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公开(公告)号：US20230257524A1
公开(公告)日：2023-08-17
申请号：US18003878
申请日：2021-06-16
CPC分类号： C08G69/26 , B29C64/40 , B33Y70/00 , B29K2077/00
摘要： The present invention relates to (co)polyamides comprising at least 85 mole % (mol. %) of recurring units (RPA) of formula (I): (I); the present invention also relates to polymer compositions comprising such (co)polyamides, as well as articles comprising the same and methods of using said articles in high temperature applications requiring sufficient swelling or deformation upon exposure to moisture, such as for example oil and gas extraction processes (e.g. fracturing balls), or as support materials used to print three-dimensional (3D) parts.
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8.发明公开公开(公告)号：US20230242759A1
公开(公告)日：2023-08-03
申请号：US17998013
申请日：2021-05-05
发明人： Matthew R. Vincent , Lee Carvell , Stéphane Jeol , Joel Flores
CPC分类号： C08L77/06 , C08G69/265 , C08L2205/025 , C08L2205/03
摘要： Described herein are polymer compositions (PC) including a polyamide (PA) and a poly(arylene sulfide) (PASP). The polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, a bis(aminoalkyl)cyclohexane, terephthalic acid, and, optionally, a cyclohexanedicarboxylic acid. It was surprisingly discovered that semi-aromatic polyamides derived from the cycloaliphatic diamine bis(aminoalkyl)cyclohexane or the specific combination of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane and the cycloaliphatic dicarboxylic acid cyclohexanedicarboxylic acid provided for polymer compositions (PC) having improved retention of mechanical properties (e.g. tensile modulus and tensile strength) after aging in aqueous polyol solutions. It was also surprisingly discovered that incorporation of a nucleating agent in the polymer composition (PC) provided for significantly improved tensile strength retention after aging. The polymer compositions (PC) can be desirably incorporated into articles that are exposed to elevated temperatures and are designed to convey or store polyol based fluids including, but not limited to, engine coolant.
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公开(公告)号：US20230212395A1
公开(公告)日：2023-07-06
申请号：US18177196
申请日：2023-03-02
CPC分类号： C08L81/06 , C08L81/02 , C08K3/32 , C08K3/26 , C08K2003/324 , C08K2003/262
摘要： A polymer composition includes a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate. Preferably, the polymer composition is free or substantially free of solvent. A method includes melt mixing a poly(para-phenylene sulfide) (PPS), at least one poly(aryl ether sulfone) (PAES), and at least one alkali metal carbonate.
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公开(公告)号：US20230183454A1
公开(公告)日：2023-06-15
申请号：US17923529
申请日：2021-05-07
发明人： Clay Plavcan , David McIlroy , Stéphane Jeol , Lee Carvell
CPC分类号： C08K7/14 , C08G69/265 , C08K3/04 , C08K5/5313 , C08K3/22 , C08K3/34 , C08K2201/019 , C08K2003/2206
摘要： Described herein are electrical articles comprising a polyamide (PA). As explained in detail below, the polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, terephthalic acid, and a bis(aminoalkyl)cyclohexane or a cyclohexanedicarboxylic acid. It was surprisingly discovered that incorporation of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane or the cycloaliphatic dicarboxylic acid cyclohexanedicarboxylic acid into the polyamide provided for polymer compositions (PC) having significantly improved comparative tracking index (“CTI”) retention after heat aging, relative to analogous polyamides derived from only the aliphatic diamine and terephthalic acid. Due at least in part to the improved CTI retention, the polyamides (PA) can be desirably incorporated into articles that, during use, are exposed to elevated temperatures and benefit from high CTI performance.
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