Embodiments disclosed herein include a package architecture. In an embodiment, the package architecture comprises a first substrate with a first fiducial mark on a surface of the first substrate. In an embodiment, the package architecture further comprises a second substrate over the first substrate, where the second substrate comprises glass and a second fiducial mark on the second substrate, and where a footprint of the second fiducial mark at least partially overlaps a footprint of the first fiducial mark.