Invention Publication
- Patent Title: SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE
-
Application No.: US18071257Application Date: 2022-11-29
-
Publication No.: US20240178157A1Publication Date: 2024-05-30
- Inventor: Vinith BEJUGAM , Whitney BRYKS , Brandon C. MARIN , Vishal Bhimrao ZADE , Deniz TURAN , Srinivas V. PIETAMBARAM
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498
Abstract:
Embodiments disclosed herein include package substrates. In a particular embodiment, the package substrate comprises a core. The core may be a glass core. In an embodiment, buildup layers are provided over the core, and a shape memory polymer (SMP) is provided over the core.
Information query
IPC分类:
