- 专利标题: INTEGRATED CIRCUIT STRUCTURES WITH CAVITY SPACERS
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申请号: US18073213申请日: 2022-12-01
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公开(公告)号: US20240186398A1公开(公告)日: 2024-06-06
- 发明人: Aaron D. LILAK , Anh PHAN , Rishabh MEHANDRU , Stephen M. CEA , Patrick MORROW , Jack T. KAVALIEROS , Justin WEBER , Salim BERRADA
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L29/49
- IPC分类号: H01L29/49 ; H01L21/28 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/51 ; H01L29/66 ; H01L29/775
摘要:
Integrated circuit structures having cavity spacers, and methods of fabricating integrated circuit structures having cavity spacers, are described. For example, an integrated circuit structure includes a sub-fin structure over a stack of nanowires. A gate structure is vertically around the stack of nanowires. An internal gate spacer is between vertically adjacent ones of the nanowires and adjacent to the gate structure. A trench contact structure is laterally adjacent to a side of the gate structure. A cavity spacer is laterally between the gate structure and the trench contact structure.
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