- 专利标题： MULTILAYER ELECTRONIC COMPONENT
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申请号： US18137500申请日： 2023-04-21
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公开(公告)号： US20240203651A1公开(公告)日： 2024-06-20
- 发明人: Yong PARK , Jong Ho LEE , Jung Jin PARK , Su Min KIM , Eun Jung LEE , Yong Min HONG , Ji Hyeon LEE , Sim Chung KANG , Min Woo KIM , Jung Tae PARK
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 优先权： KR 20220175001 2022.12.14
- 主分类号： H01G4/12
- IPC分类号： H01G4/12 ; H01G4/30
摘要：
A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body. The dielectric layer includes N-doped polydopamine.
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