公开(公告)号：US20240071689A1

公开(公告)日：2024-02-29

申请号：US18127234

申请日：2023-03-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myung Chan SON ,  Yong PARK ,  Jong Ho LEE ,  Eun Jung LEE ,  Jung Tae PARK ,  Min Woo KIM ,  Ji Hyeon LEE ,  Sun Mi KIM

IPC: H01G4/30 ,  C04B35/64 ,  H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  C04B35/64 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

Abstract: A method of manufacturing a multilayer electronic component includes forming a stack by stacking a plurality of ceramic green sheets on which conductive patterns are disposed on a support film, cutting the stack in a second direction, perpendicular to a first direction which is a stacking direction of the plurality of ceramic green sheets, cutting the stack in a third direction, perpendicular to the first and second directions, to obtain a plurality of unit chips, separating the unit chip from the support film, arranging the unit chip such that one of side surfaces of the unit chip is in contact with an adhesive tape, and attaching another one of the side surfaces to a ceramic green sheet for a side margin portion, and forming a side margin portion on the another one of side surfaces.

公开(公告)号：US20240203651A1

公开(公告)日：2024-06-20

申请号：US18137500

申请日：2023-04-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong PARK ,  Jong Ho LEE ,  Jung Jin PARK ,  Su Min KIM ,  Eun Jung LEE ,  Yong Min HONG ,  Ji Hyeon LEE ,  Sim Chung KANG ,  Min Woo KIM ,  Jung Tae PARK

IPC: H01G4/12 ,  H01G4/30

CPC classification number: H01G4/1227 ,  H01G4/30

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body. The dielectric layer includes N-doped polydopamine.

公开(公告)号：US20240145173A1

公开(公告)日：2024-05-02

申请号：US18205104

申请日：2023-06-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Hyeon LEE ,  Jong Ho LEE ,  Eun Jung LEE ,  Yong Min HONG ,  Yong PARK ,  Min Woo KIM ,  Jung Tae PARK ,  Sun Mi KIM ,  Sim Chung KANG

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/232

Abstract: A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.