Invention Publication
- Patent Title: HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS
-
Application No.: US18067207Application Date: 2022-12-16
-
Publication No.: US20240203816A1Publication Date: 2024-06-20
- Inventor: Kisik Choi , Nicholas Alexander POLOMOFF , Brent A. Anderson , Lawrence A. Clevenger , Ruilong Xie , Terence Hook , Matthew Angyal , FEE LI LIE
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/00 ; H01L23/522 ; H01L23/528
Abstract:
Semiconductor devices and methods of forming the same include a front-end-of-line (FEOL) layer. A back-end-of-line (BEOL) layer includes a thermal transfer structure in contact with the FEOL layer. A carrier wafer is bonded to the BEOL layer and includes a thermal dissipation structure in contact with the thermal transfer structure.
Information query
IPC分类:
