Invention Publication
- Patent Title: TRANSFER-FREE 2D FET AND FEFET DEVICE FABRICATION BY 2D MATERIAL GROWTH IN SUPERLATTICE WITH NITRIDES
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Application No.: US18091209Application Date: 2022-12-29
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Publication No.: US20240222485A1Publication Date: 2024-07-04
- Inventor: Mahmut Sami Kavrik , Tristan Tronic , Chelsey Dorow , Kevin O?Brien , Uygar Avci , Carl H. Naylor , Chia-Ching Lin , Dominique Adams , Matthew Metz , Ande Kitamura , Scott B. Clendenning
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/775
- IPC: H01L29/775 ; H01L27/088 ; H01L29/06 ; H01L29/26 ; H01L29/423 ; H01L29/66

Abstract:
A transistor structure includes a stack of nanoribbons coupling source and drain terminals. The nanoribbons may each include a pair of crystalline interface layers and a channel layer between the interface layers. The channel layers may be a molecular monolayer, including a metal and a chalcogen, with a thickness of less than 1 nm. The channel layers may be substantially monocrystalline, and the interface layers may be lattice matched to the channel layers. The channel layers may be epitaxially grown over the lattice-matched interface layers. The crystalline interface layers may be grown over sacrificial layers when forming the stack of nanoribbons.
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