发明公开
- 专利标题: APPARATUS AND METHOD
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申请号: US18619217申请日: 2024-03-28
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公开(公告)号: US20240241854A1公开(公告)日: 2024-07-18
- 发明人: Garrett CLAY , Jaemon FRANKO , Heung-for CHENG
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: G06F15/80
- IPC分类号: G06F15/80 ; G06F1/20
摘要:
Some aspects of the present disclosure relate to an apparatus comprising memory circuitry, machine-readable instructions, and processor circuitry to execute the machine-readable instructions to obtain a physical layout of a first processor circuitry comprising a plurality of processor cores and thermal information of the plurality of processor cores and to determine a first processor core of the plurality of processor cores to execute a first work-load based on the physical layout of the first processor circuitry and the thermal information of the plurality of processor cores.
公开/授权文献
- US1378145A Electrolytic deposition of copper from acid solutions 公开/授权日:1921-05-17
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