- 专利标题: BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS
-
申请号: US18123613申请日: 2023-03-20
-
公开(公告)号: US20240321747A1公开(公告)日: 2024-09-26
- 发明人: Ruilong Xie , Christopher J. Penny , Kisik Choi , Koichi Motoyama , Nicholas Anthony Lanzillo , Chih-Chao Yang
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L23/528
- IPC分类号: H01L23/528 ; H01L21/78 ; H01L21/8238 ; H01L27/092 ; H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/775
摘要:
A semiconductor structure is provided that includes a plurality of backside power islands, rather than backside power rails. The backside power islands are present in a first device track and a second device track. Each backside power island located in the first device track and the second device track are isolated by a first cut region, and the backside power islands that are located in the first device track are separated from the backside power islands located in the second device track by a second cut region. The second cut region is oriented perpendicular to the first cut region.
信息查询
IPC分类: