A method for forming a shielding layer to a semiconductor device, wherein the semiconductor device comprises a substrate, one or more electronic components on a front surface of the substrate, an encapsulant layer on the front surface of the substrate that covers the one or more electronic components and one or more connectors on a back surface of the substrate, the method comprising: applying a coating layer onto the back surface of the substrate to cover the one or more connectors; attaching the coating layer onto a tape to load the semiconductor device to the tape, wherein the attachment between the coating layer and the tape is stronger than the attachment between the coating layer and the back surface of the substrate as well as the one or more connectors; forming the shielding layer onto the encapsulant layer to cover the one or more electronic components; and unloading the semiconductor device from the tape, wherein the coating layer is left on the tape.