公开(公告)号：US20230260881A1

公开(公告)日：2023-08-17

申请号：US18163884

申请日：2023-02-03

Applicant: STATS ChipPAC Pte. Ltd

Inventor： HyunSeok PARK ,  SinJae KIM ,  YongMoo SHIN ,  DongJun SEO

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L21/60

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L25/16 ,  H01L21/60

Abstract: A semiconductor device and a method for making the same are provided. The method includes: providing a package including: a substrate including a first surface and a second surface opposite to the first surface; a first electronic component mounted on the first surface of the substrate; a conductive pillar formed on the first surface of the substrate, wherein a height of the conductive pillar is smaller than a height of the first electronic component; and a first encapsulant disposed on the first surface of the substrate and covering the first electronic component and the conductive pillar; forming a groove in the first encapsulant to expose a top surface and a portion of a lateral surface of the conductive pillar; and forming a bump in the groove, wherein the bump covers the top surface and the exposed portion of the lateral surface of the conductive pillar.

公开(公告)号：US20240343055A1

公开(公告)日：2024-10-17

申请号：US18619148

申请日：2024-03-27

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： HyunSeok PARK ,  KyoWang KOO ,  SeongKuk KIM ,  SeokBeom HEO

IPC: B41N1/24 ,  B23K1/00 ,  B23K1/20 ,  B23K101/40 ,  B41C1/14 ,  B41M1/12 ,  B41M1/26 ,  G03F7/00 ,  H01L23/00

CPC classification number: B41N1/248 ,  B23K1/0016 ,  B23K1/203 ,  B41C1/148 ,  B41M1/12 ,  B41M1/26 ,  G03F7/0035 ,  H01L24/11 ,  H01L24/81 ,  B23K2101/40 ,  H01L2224/1147 ,  H01L2224/81815

Abstract: A selective stencil mask and a stencil printing method are provided. The stencil mask is for printing a fluid material onto a substrate, and comprises: a stencil member comprising: at least one printing region each having an array of apertures that allow the fluid material to flow therethrough and deposit onto the substrate; and a blocking region configured to prevent the fluid material from flowing therethrough; and a supporting member attached to the stencil member and configured to, when the stencil mask is placed on the substrate, contact the substrate and create a gap between the stencil member and the substrate.

公开(公告)号：US20240332209A1

公开(公告)日：2024-10-03

申请号：US18603185

申请日：2024-03-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JiSik MOON ,  KyoWang KOO ,  HyunSeok PARK

IPC: H01L23/552 ,  H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L23/552 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49816 ,  H01L25/16

Abstract: A method for forming a shielding layer to a semiconductor device, wherein the semiconductor device comprises a substrate, one or more electronic components on a front surface of the substrate, an encapsulant layer on the front surface of the substrate that covers the one or more electronic components and one or more connectors on a back surface of the substrate, the method comprising: applying a coating layer onto the back surface of the substrate to cover the one or more connectors; attaching the coating layer onto a tape to load the semiconductor device to the tape, wherein the attachment between the coating layer and the tape is stronger than the attachment between the coating layer and the back surface of the substrate as well as the one or more connectors; forming the shielding layer onto the encapsulant layer to cover the one or more electronic components; and unloading the semiconductor device from the tape, wherein the coating layer is left on the tape.