公开(公告)号：US20230230856A1

公开(公告)日：2023-07-20

申请号：US18154024

申请日：2023-01-12

Applicant: STATS ChipPAC Pte. Ltd

Inventor： YoungSang KIM ,  JiEun KWON ,  JiSik MOON

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48

CPC classification number: H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/552 ,  H01L21/4853

Abstract: A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a first surface and a second surface opposite to the first surface; a first electronic component mounted on the first surface of the substrate; a second electronic component mounted on the second surface; and a contact pad formed on the second surface of the substrate, wherein the contact pad is outside of a projection of the second electronic component on the second surface of the substrate; and a first encapsulant disposed on the first surface of the substrate and covering the first electronic component; forming a second encapsulant over and around the second electronic component, wherein the contact pad is exposed from the second encapsulant; planarizing the second encapsulant to expose the second electronic component; and forming a bump on the contact pad of the second surface of the substrate.

公开(公告)号：US20240332209A1

公开(公告)日：2024-10-03

申请号：US18603185

申请日：2024-03-12

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JiSik MOON ,  KyoWang KOO ,  HyunSeok PARK

IPC: H01L23/552 ,  H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L23/552 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49816 ,  H01L25/16

Abstract: A method for forming a shielding layer to a semiconductor device, wherein the semiconductor device comprises a substrate, one or more electronic components on a front surface of the substrate, an encapsulant layer on the front surface of the substrate that covers the one or more electronic components and one or more connectors on a back surface of the substrate, the method comprising: applying a coating layer onto the back surface of the substrate to cover the one or more connectors; attaching the coating layer onto a tape to load the semiconductor device to the tape, wherein the attachment between the coating layer and the tape is stronger than the attachment between the coating layer and the back surface of the substrate as well as the one or more connectors; forming the shielding layer onto the encapsulant layer to cover the one or more electronic components; and unloading the semiconductor device from the tape, wherein the coating layer is left on the tape.

公开(公告)号：US20230268315A1

公开(公告)日：2023-08-24

申请号：US18165347

申请日：2023-02-07

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JiSik MOON ,  DongJun SEO ,  JungSub LEE ,  KyoWang KOO

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/78 ,  H01L23/552

CPC classification number: H01L24/94 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/552 ,  H01L2224/94

Abstract: The present application relates to a method for making semiconductor packages. The method for making semiconductor packages comprises forming a semiconductor package array, the semiconductor package array having at its first side a interconnect encasing layer; attaching an adhesive tape onto the interconnect encasing layer, wherein the adhesive layer has an adhesive layer and a base film; removing, by a laser beam, the base film of the adhesive tape at a predetermined ablation region; and singulating the semiconductor package array along the predetermined ablation regions to separate the semiconductor package array into a plurality of semiconductor packages.