发明公开
- 专利标题: INTERCONNECT FABRIC LINK WIDTH REDUCTION TO REDUCE INSTANTANEOUS POWER CONSUMPTION
-
申请号: US18657176申请日: 2024-05-07
-
公开(公告)号: US20240353912A1公开(公告)日: 2024-10-24
- 发明人: Mohammed Tameem , Altug Koker , Kiran C. Veernapu , Abhishek R. Appu , Ankur N. Shah , Joydeep Ray , Travis T. Schluessler , Jonathan Kennedy
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: G06F1/3234
- IPC分类号: G06F1/3234 ; G06F1/3206 ; G06F1/324 ; G06F1/3287 ; G06F1/3296 ; G06F13/16 ; G06F13/40
摘要:
Described herein are various embodiments of reducing dynamic power consumption within a processor device. One embodiment provides a technique for dynamic link width adjustment based on throughput demand for client of an interconnect fabric. One embodiment provides for a parallel processor comprising an interconnect fabric including a dynamically configurable bus widths and frequencies.
信息查询