- 专利标题: MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
-
申请号: US18432474申请日: 2024-02-05
-
公开(公告)号: US20240355548A1公开(公告)日: 2024-10-24
- 发明人: Yong PARK , Min Woo KIM , Jong Ho LEE , Eun Jung LEE , Yong Min HONG , Yong Ung LEE , Jung Tae PARK
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20230052714 2023.04.21
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; C04B35/64 ; H01G4/008 ; H01G4/012 ; H01G4/12 ; H01G4/224
摘要:
In an example embodiment of the present disclosure, an average distance in the first direction from the active-cover boundary to an end of the side margin portion in the first direction closest to the active-cover boundary among ends of the side margin portion in the first direction is defined as A1, and an average distance in the third direction from the first body-side margin boundary to an end of the side margin portion in the third direction closest to the first body-side margin boundary among ends of the side margin portion in the third direction is defined as A2, and then, A1/A2 is adjusted.
信息查询