公开(公告)号：US20240355548A1

公开(公告)日：2024-10-24

申请号：US18432474

申请日：2024-02-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong PARK ,  Min Woo KIM ,  Jong Ho LEE ,  Eun Jung LEE ,  Yong Min HONG ,  Yong Ung LEE ,  Jung Tae PARK

IPC: H01G4/30 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

CPC classification number: H01G4/30 ,  C04B35/64 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

Abstract: In an example embodiment of the present disclosure, an average distance in the first direction from the active-cover boundary to an end of the side margin portion in the first direction closest to the active-cover boundary among ends of the side margin portion in the first direction is defined as A1, and an average distance in the third direction from the first body-side margin boundary to an end of the side margin portion in the third direction closest to the first body-side margin boundary among ends of the side margin portion in the third direction is defined as A2, and then, A1/A2 is adjusted.

公开(公告)号：US20240112864A1

公开(公告)日：2024-04-04

申请号：US18219854

申请日：2023-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong PARK ,  Jung Tae PARK ,  Jong Ho LEE ,  Eun Jung LEE ,  Yong Min HONG ,  Jung Jin PARK ,  Rak Hyeon BAEK ,  Sun Mi KIM ,  Yong Ung LEE

IPC: H01G4/30

CPC classification number: H01G4/30

Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.