Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE HAVING MEMORY CELL AND STAIRCASE STRUCTURE AND METHODS OF FABRICATING THEREOF
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Application No.: US18770406Application Date: 2024-07-11
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Publication No.: US20240365557A1Publication Date: 2024-10-31
- Inventor: Sai-Hooi Yeong , Bo-Feng Young , Yu-Ming Lin , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- The original application number of the division: US17106516 2020.11.30
- Main IPC: H10B51/20
- IPC: H10B51/20 ; H01L21/28 ; H01L29/78 ; H01L29/786 ; H10B51/00 ; H10B51/10 ; H10B51/30

Abstract:
A device includes a first channel; a second channel above the first channel; and a gate structure surrounding the first and second channels, wherein the gate structure includes a ferroelectric (FE) layer surrounding the first and second channels and a gate metal layer surrounding the FE layer. The device further includes two first electrodes connected to two sides of the first channel; two second electrodes connected to two sides of the second channel; a dielectric layer between the first and the second electrodes; and an inner spacer layer between the two first electrodes and the gate structure.
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