Invention Application
- Patent Title: CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
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Application No.: US18774379Application Date: 2024-07-16
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Publication No.: US20240371796A1Publication Date: 2024-11-07
- Inventor: Harry Walter SAX , Johann GATTERBAUER , Wolfgang LEHNERT , Evelyn NAPETSCHNIG , Michael ROGALLI
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102020114527.6 20200529
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/31
Abstract:
A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.
Information query
IPC分类:
